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nfo
rm
a
t
ics a
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Co
m
m
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ica
t
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ec
hn
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(
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J
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CT
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Vo
l.
1
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3
,
Sep
tem
b
er
20
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p
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1
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I
SS
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o
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m
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h
ttp
:
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ict.
ia
esco
r
e.
co
m
Enha
nced t
herma
l ma
na
g
ement in
3
D
integra
ted
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cuits
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upling
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pa
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a
ik
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us
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in Va
li
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r
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l
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dh
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urk
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d
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a
Art
icle
I
nfo
AB
S
T
RAC
T
A
r
ticle
his
to
r
y:
R
ec
eiv
ed
Ma
y
2
0
,
2
0
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5
R
ev
is
ed
Ap
r
1
7
,
2
0
2
6
Acc
ep
ted
Ma
y
1
7
,
2
0
2
6
3
D
IC
in
teg
ra
ti
o
n
,
wh
ich
c
o
m
p
r
i
se
s
v
e
rti
c
a
ll
y
sta
c
k
in
g
se
v
e
ra
l
IC
lay
e
rs,
is
o
n
e
o
f
th
e
n
e
w
tec
h
n
o
l
o
g
ies
th
a
t
wo
rk
s
we
ll
wit
h
c
o
m
p
lem
e
n
t
a
ry
m
e
tal
-
o
x
i
d
e
-
s
e
m
ico
n
d
u
c
t
o
r
(
CM
OS
)
i
m
p
lem
e
n
tatio
n
s.
T
h
e
lay
e
rs
o
f
a
th
re
e
-
d
ime
n
sio
n
a
l
i
n
teg
ra
ted
c
ircu
it
(
3
D
IC)
a
re
p
h
y
sic
a
ll
y
a
n
d
e
lec
tri
c
a
ll
y
c
o
n
n
e
c
ted
v
ia
c
o
p
p
e
r
-
sil
ico
n
b
o
n
d
in
g
a
n
d
t
h
ro
u
g
h
sili
c
o
n
v
ias
(TS
Vs
).
Li
m
it
a
ti
o
n
s
i
n
3
D
IC
d
e
sig
n
s,
su
c
h
a
s
lay
e
r
-
to
-
lay
e
r
th
e
rm
a
l
d
iffi
c
u
lt
ies
a
n
d
TS
V
-
to
-
su
b
stra
te
a
n
d
T
S
V
-
to
-
T
S
V
n
o
ise
c
o
u
p
li
n
g
,
sig
n
ifi
c
a
n
tl
y
imp
a
c
t
sy
ste
m
p
e
rfo
rm
a
n
c
e
a
s
a
w
h
o
le.
In
teg
ra
t
in
g
3D
ICs
re
li
e
s
h
e
a
v
il
y
o
n
h
e
a
t
sp
re
a
d
e
rs
a
n
d
t
h
e
rm
a
l
th
ro
u
g
h
sili
c
o
n
v
ias
(TT
S
Vs
).
Ov
e
rh
e
a
ti
n
g
is
a
c
o
m
m
o
n
c
a
u
se
o
f
IC
fa
il
u
re
;
h
o
w
e
v
e
r,
h
e
a
t
sp
re
a
d
e
rs
a
n
d
F
IN
t
o
T
TS
V
h
a
v
e
b
e
e
n
su
g
g
e
ste
d
a
s
p
o
ten
ti
a
l
re
m
e
d
ies
fo
r
th
is
p
r
o
b
lem
i
n
th
e
las
t
f
e
w
y
e
a
rs.
A
3
D
IC
m
ig
h
t
m
e
lt
u
n
d
e
r
t
h
e
stre
ss
o
f
a
n
a
p
p
li
e
d
v
o
lt
a
g
e
b
e
c
a
u
se
it
b
e
c
o
m
e
s
h
o
tt
e
r
in
sid
e
.
E
n
g
in
e
e
rs
h
a
v
e
a
d
d
e
d
fin
s
t
o
th
e
TT
S
V
i
n
a
n
u
m
b
e
r
o
f
wa
y
s,
e
a
c
h
o
f
wh
ic
h
m
a
x
imiz
e
s
h
e
a
t
d
issip
a
ti
o
n
in
a
d
i
ffe
re
n
t
wa
y
,
i
n
o
rd
e
r
t
o
re
d
u
c
e
t
h
is
d
a
n
g
e
r.
T
h
e
e
x
c
e
p
ti
o
n
a
l
th
e
rm
a
l
c
o
o
li
n
g
c
h
a
r
a
c
teristics
o
f
g
ra
p
h
e
n
e
a
n
d
c
a
rb
o
n
n
a
n
o
t
u
b
e
s
(CNTs)
h
a
v
e
le
d
t
o
th
e
ir
wid
e
sp
re
a
d
d
isse
m
in
a
ti
o
n
.
Th
is
re
se
a
rc
h
sh
o
ws
th
a
t
a
F
IN
m
a
y
e
fficie
n
tl
y
tran
sp
o
r
t
th
e
rm
a
l
e
n
e
rg
y
to
a
h
e
a
t
sin
k
b
y
u
si
n
g
h
e
a
t
sp
re
a
d
e
rs
a
n
d
o
p
ti
m
u
m
o
rien
tati
o
n
s
to
d
istr
ib
u
te
h
e
a
t
in
a
ll
d
irec
ti
o
n
s.
Ad
d
it
i
o
n
a
ll
y
,
we
d
e
m
o
n
stra
ted
t
h
e
m
a
n
y
sc
e
n
a
rio
s
in
w
h
ich
th
e
IC'
s
p
o
ten
t
ial
d
istr
ib
u
ti
o
n
is
imp
a
c
ted
b
y
v
a
rio
u
s th
e
rm
a
l
c
o
o
l
in
g
e
ffe
c
ts.
We fo
u
n
d
th
a
t
wh
e
n
i
t
c
o
m
e
s to
tran
sfe
rrin
g
h
e
a
t
a
wa
y
fr
o
m
h
e
a
t
so
u
rc
e
s
a
n
d
T
S
Vs
,
CNTs
o
u
tp
e
rfo
rm
G
ra
p
h
e
n
e
.
We
in
c
l
u
d
e
d
Al2
o
3
,
S
i
3
N4
,
a
n
d
S
iO2
a
s
e
x
a
m
p
les
t
o
e
x
a
m
in
e
th
e
c
o
n
se
q
u
e
n
c
e
s o
f
m
o
d
i
fy
i
n
g
th
e
m
o
d
e
l'
s d
iele
c
tri
c
c
h
a
ra
c
teristics
.
K
ey
w
o
r
d
s
:
C
ar
b
o
n
n
an
o
tu
b
es
FIN
Hea
t so
u
r
ce
T
h
er
m
al
th
r
o
u
g
h
s
ilico
n
v
ia
n
o
is
e
co
u
p
lin
g
T
h
r
ee
-
d
im
e
n
s
io
n
al
in
teg
r
ate
d
cir
cu
it
T
h
is i
s
a
n
o
p
e
n
a
c
c
e
ss
a
rticle
u
n
d
e
r th
e
CC B
Y
-
SA
li
c
e
n
se
.
C
o
r
r
e
s
p
o
nd
ing
A
uth
o
r
:
Vem
p
alle
R
af
i
Dep
ar
tm
en
t o
f
E
lectr
ical
an
d
E
lectr
o
n
ics E
n
g
in
ee
r
i
n
g
J
NT
UA
C
o
lleg
e
o
f
E
n
g
in
ee
r
in
g
Pu
liv
en
d
u
la
Kad
ap
a,
I
n
d
ia
E
m
ail: v
em
p
aller
af
i@
g
m
ail.
c
o
m
1.
I
NT
RO
D
UCT
I
O
N
Sin
ce
th
e
tr
an
s
is
to
r
i
s
th
e
p
r
im
ar
y
b
u
ild
in
g
b
lo
c
k
o
f
elec
tr
o
n
ics,
m
etal
-
o
x
id
e
-
s
em
i
co
n
d
u
ct
o
r
f
ield
-
ef
f
ec
t
tr
an
s
is
to
r
s
(
MO
S
FET
s
)
p
lay
a
cr
u
cial
r
o
le
in
th
e
I
o
T
.
On
e
m
eth
o
d
f
o
r
d
ev
elo
p
in
g
co
m
p
ac
t
elec
tr
o
n
ic
g
o
o
d
s
is
MO
SF
E
T
s
ca
lin
g
,
wh
ich
is
d
escr
ib
e
d
b
y
Mo
o
r
e'
s
law
f
o
r
c
o
n
te
m
p
o
r
ar
y
tech
n
o
lo
g
y
.
Evaluation Warning : The document was created with Spire.PDF for Python.
I
n
t J I
n
f
&
C
o
m
m
u
n
T
ec
h
n
o
l
I
SS
N:
2252
-
8
7
7
6
E
n
h
a
n
ce
d
th
erma
l m
a
n
a
g
eme
n
t in
3
D
in
teg
r
a
ted
circu
its
co
u
p
lin
g
(
V
emp
a
lle
R
a
fi
)
1209
Sin
ce
th
e
in
teg
r
ated
cir
cu
its
(
IC
)
is
f
lat,
in
cr
ea
s
in
g
th
e
s
i
ze
o
f
th
e
tr
an
s
is
to
r
to
s
av
e
m
an
u
f
ac
tu
r
in
g
s
p
ac
e
n
ec
ess
itates
m
o
r
e
m
etal
lay
er
s
.
W
ir
e
d
elay
s
an
d
wir
e
d
en
s
ity
b
o
th
in
cr
ea
s
e
d
u
e
to
th
e
p
r
ese
n
ce
o
f
th
ese
m
etal
lay
er
s
[
1
]
–
[
5
]
.
Ma
n
u
f
ac
tu
r
in
g
I
C
s
b
ec
o
m
es
m
o
r
e
d
if
f
icu
lt
wh
en
p
ar
asit
ic
ca
p
ac
itan
ce
r
is
es
d
u
e
to
th
e
in
cr
ea
s
ed
wir
e
d
e
n
s
ity
.
Par
asit
ic
ca
p
ac
itan
ce
d
o
m
in
ates
an
d
ca
u
s
es
d
elay
s
in
in
ter
c
o
n
n
e
cts.
T
h
e
co
n
n
ec
tio
n
laten
cy
b
ec
am
e
a
n
is
s
u
e
with
th
e
tr
an
s
is
to
r
d
elay
.
As
s
ca
lab
ilit
y
in
cr
ea
s
es,
h
o
wev
er
,
th
e
is
s
u
e
o
f
co
n
n
ec
tio
n
laten
cy
b
ec
o
m
es
m
o
r
e
p
r
ess
in
g
[
6
]
,
[
7
]
.
C
o
n
ce
r
n
a
b
o
u
t
t
h
e
n
ee
d
to
d
ec
r
ea
s
e
co
n
n
ec
tio
n
l
aten
cy
ar
o
s
e
in
s
id
e
th
e
I
C
.
An
alter
n
ate
tech
n
iq
u
e
th
at
h
as
s
h
o
wn
p
r
o
m
is
e
is
th
e
th
r
ee
-
d
im
e
n
s
io
n
al
IC
(
3
D
I
C
)
.
T
h
e
I
C
is
s
tu
d
ied
in
all
th
r
ee
d
im
en
s
io
n
s
.
C
u
r
r
e
n
t
co
n
s
p
ir
ato
r
th
e
r
e
is
a
tr
ad
e
-
o
f
f
in
ter
m
s
o
f
s
y
s
tem
p
er
f
o
r
m
an
ce
wh
en
u
s
in
g
two
-
d
im
en
s
io
n
al
IC
s
(
2
D
I
C
)
b
ec
au
s
e
o
f
th
eir
lo
wer
d
ev
ice
p
ac
k
in
g
d
en
s
ities
[
8
]
–
[
1
0
]
.
T
h
e
3
D
I
C
h
as
r
ep
lace
d
t
h
e
two
-
d
im
en
s
io
n
a
l
IC
(
2
D
I
C
)
as
t
h
e
s
tate
-
of
-
th
e
-
ar
t
tec
h
n
o
lo
g
y
d
u
e
to
its
in
cr
ea
s
ed
s
ig
n
a
l
b
an
d
wid
th
an
d
ab
ilit
y
to
h
o
s
t
m
illi
o
n
s
o
f
d
ev
ices.
I
n
a
d
d
itio
n
,
th
e
a
d
v
en
t
o
f
3
D
I
C
tech
n
o
lo
g
y
a
n
d
h
eter
o
g
en
e
o
u
s
in
teg
r
atio
n
h
a
s
m
ad
e
p
r
o
d
u
ctio
n
f
o
r
th
e
s
e
m
ico
n
d
u
ct
o
r
in
d
u
s
tr
y
m
o
r
e
e
asier
.
T
h
e
th
er
m
al
r
esis
tan
ce
m
ea
s
u
r
es
h
o
w
m
u
ch
h
ea
t
is
lo
s
t
f
r
o
m
th
e
c
h
ip
'
s
cir
cu
it
ju
n
ctio
n
t
o
its
o
u
ts
id
e.
B
y
c
o
o
lin
g
th
e
s
em
ico
n
d
u
cto
r
,
th
er
m
al
f
lo
w
lim
its
th
er
m
al
r
esis
tan
ce
.
T
h
e
th
er
m
al
r
esis
tan
ce
o
f
a
c
h
ip
in
cr
ea
s
es
with
th
e
n
u
m
b
er
o
f
la
y
er
s
it
h
as.
Du
e
t
o
th
e
s
m
all
s
ize
o
f
th
e
d
ev
ices
u
s
ed
in
3
D
I
C
,
cr
o
s
s
-
co
u
p
lin
g
s
f
o
r
m
b
etwe
en
th
e
v
ar
io
u
s
co
m
p
o
n
en
ts
in
th
e
lay
er
[
1
1
]
,
[
1
2
]
.
C
r
o
s
s
-
talk
is
an
o
th
er
n
am
e
f
o
r
cr
o
s
s
-
co
u
p
lin
g
.
W
h
en
th
er
e
is
less
s
p
ac
e
b
etwe
en
th
e
lay
er
s
,
co
m
m
u
n
icatio
n
b
etwe
en
th
em
i
m
p
r
o
v
es.
T
h
is
is
a
m
ajo
r
p
r
o
b
lem
with
th
e
3
D
I
C
d
esig
n
.
Ad
d
itio
n
ally
,
IC
s
s
u
f
f
er
f
r
o
m
th
e
is
s
u
e
o
f
v
e
r
tical
c
r
o
s
s
-
talk
.
An
I
C
m
a
y
h
a
v
e
cr
o
s
s
-
talk
b
etwe
en
its
ac
tiv
e
lay
er
s
.
L
ay
er
s
tack
in
g
o
n
a
h
ig
h
-
q
u
ality
s
em
ico
n
d
u
cto
r
is
d
am
ag
in
g
t
o
th
e
m
a
n
u
f
ac
t
u
r
in
g
m
et
h
o
d
[
1
3
]
.
Gettin
g
r
id
o
f
o
r
m
ak
in
g
g
o
o
d
u
s
e
o
f
in
ter
f
er
en
ce
is
th
e
f
ir
s
t
s
tep
in
f
ix
in
g
3
D
I
C
'
s
m
ain
is
s
u
e.
T
o
s
o
lv
e
th
is
is
s
u
e,
s
ev
er
al
d
if
f
er
en
t c
ir
cu
its
will b
e
co
n
s
tr
u
cted
.
T
h
e
m
ain
r
estrictio
n
s
o
f
3
D
tech
n
o
lo
g
y
ar
e
n
o
is
e
co
u
p
lin
g
an
d
th
er
m
al
is
s
u
es.
No
is
e
co
u
p
lin
g
is
th
e
co
n
n
ec
tio
n
b
et
wee
n
th
e
u
s
e
o
f
h
ig
h
-
p
er
f
o
r
m
an
ce
m
ater
ials
f
o
r
th
er
m
al
m
an
ag
e
m
en
t
in
3
D
I
C
d
esig
n
,
in
clu
d
in
g
s
ilico
n
n
itrid
e
(
Si3
N4
)
,
al
u
m
i
n
iu
m
o
x
id
e
(
Al2
O3
)
,
a
n
d
s
ilico
n
d
io
x
id
e
(
SiO2
)
.
2.
M
O
DE
L
DE
SCR
I
P
T
I
O
N
U
SI
NG
T
SV
B
ec
au
s
e
o
f
th
e
wea
k
elec
t
r
ical
co
m
m
u
n
icatio
n
b
etwe
e
n
th
r
o
u
g
h
s
ilico
n
v
ias
(
T
S
Vs
)
an
d
Si
s
u
b
s
tr
ate,
wh
ich
ca
u
s
es
n
o
is
y
co
u
p
lin
g
d
is
tu
r
b
an
ce
s
b
etwe
en
ag
g
r
ess
iv
e
a
n
d
v
ictim
T
Vs
an
d
b
etwe
en
ac
tiv
e
d
ev
ices
an
d
Si
s
u
b
s
tr
ate,
th
is
3D
I
C
in
teg
r
atio
n
is
p
r
im
ar
ily
m
o
tiv
ated
b
y
th
i
s
is
s
u
e
[
1
4
]
–
[
1
8
]
.
T
h
e
p
r
o
b
lem
o
f
n
o
is
e
co
u
p
l
in
g
b
etwe
en
T
SVs
an
d
th
e
Si
s
u
b
s
tr
ate
m
ay
b
e
s
o
lv
ed
b
y
u
s
in
g
th
e
r
ig
h
t
tech
n
iq
u
e.
T
h
is
T
SV
-
b
ased
3
D
I
C
s
u
f
f
er
s
f
r
o
m
th
e
s
am
e
n
o
is
e
co
u
p
lin
g
an
d
h
ea
t
p
r
o
b
lem
s
as
its
2
D
co
u
n
ter
p
a
r
t.
E
T
SV,
wh
ich
is
n
o
th
in
g
m
o
r
e
th
a
n
elec
tr
ical
t
h
r
o
u
g
h
s
ilico
n
-
v
ia,
ex
p
er
ien
ce
s
n
o
is
e
co
u
p
lin
g
as
a
co
n
s
eq
u
en
ce
o
f
in
s
u
f
f
icien
t
e
lectr
ical
s
ig
n
alin
g
,
wh
ile
th
er
m
al
T
SV
(
T
T
SV
)
,
wh
ich
is
n
o
th
in
g
m
o
r
e
th
an
th
er
m
al
v
ia
s
i
lico
n
-
v
ia,
ex
p
er
i
en
ce
s
h
ea
t
as
a
r
esu
lt
o
f
in
c
r
e
asin
g
h
ea
t.
3D
IC
s
h
av
e
a
h
i
g
h
er
ap
p
lied
p
o
ten
tial
[
1
7
]
,
[
1
8
]
.
W
ith
th
is
wo
r
k
,
we
p
r
o
p
o
s
e
a
s
o
lu
tio
n
to
th
e
s
tated
p
r
o
b
lem
,
wh
ich
is
th
at
th
e
ef
f
ec
t
o
f
h
e
at
o
n
a
n
I
C
v
ar
ies
d
ep
en
d
in
g
o
n
th
e
d
i
r
ec
tio
n
in
wh
ich
th
e
h
ea
t
tr
av
els
[
1
9
]
–
[
2
5
]
.
Fo
r
in
s
tan
ce
,
if
h
ea
t
is
tr
an
s
f
er
r
ed
f
r
o
m
th
e
h
ea
t so
u
r
ce
to
th
e
h
e
at
s
in
k
in
a
s
in
g
le
d
ir
ec
tio
n
,
th
e
I
C
m
ay
b
e
d
am
ag
ed
.
Fig
u
r
e
1
s
h
o
ws
th
e
th
er
m
al
m
an
ag
em
en
t
e
f
f
icien
cy
o
f
a
t
wo
-
s
tack
ed
s
tr
u
ctu
r
e,
wh
ic
h
is
an
aly
ze
d
u
s
in
g
f
in
s
a
n
d
s
p
r
ea
d
er
s
with
ca
r
b
o
n
n
an
o
tu
b
es
(
C
NT
)
an
d
Gr
ap
h
en
e
as
test
m
ater
ials
.
T
h
e
im
p
ac
t
o
n
s
ig
n
al
in
teg
r
ity
an
d
h
ea
t
d
is
s
ip
atio
n
f
r
o
m
a
1
μ
W
h
o
ts
p
o
t
(
1
μ
m
×
1
μ
m
×
0
.
5
μ
m
)
is
also
ev
alu
at
ed
.
I
n
th
is
ar
ticle,
I
'
ll
ex
p
lain
h
o
w
tr
ad
itio
n
al
3
D
I
C
ar
ch
itectu
r
e
a
n
d
g
r
ap
h
en
e
-
b
ased
FIN
h
ea
t
s
p
r
ea
d
er
s
wo
r
k
to
g
eth
e
r
to
p
r
o
v
id
e
a
n
o
p
tim
al
h
ea
t
-
m
an
a
g
em
en
t so
lu
tio
n
.
T
o
f
u
r
th
er
a
d
d
r
ess
th
e
is
s
u
e
o
f
th
e
I
C
'
s
T
T
S
V
with
o
u
t FI
N
an
d
with
a
h
ea
t
s
p
r
ea
d
e
r
(
g
r
ap
h
en
e
an
d
C
NT
)
,
we
tu
r
n
th
e
f
in
to
war
d
s
th
e
h
ea
t
s
o
u
r
ce
a
n
d
th
e
f
in
to
war
d
s
th
e
cy
lin
d
er
.
T
h
is
d
em
o
n
s
tr
ates h
o
w
h
ea
t im
p
ac
ts
in
d
if
f
e
r
en
t d
i
r
ec
tio
n
s
.
T
ab
le
1
in
d
icate
s
th
e
Su
g
g
ested
m
ater
ial
f
o
r
Fin
an
d
Sp
r
ea
d
e
r
s
f
o
r
e
f
f
e
ctiv
e
th
er
m
al
m
an
a
g
em
en
t
.
Fi
g
u
r
e
2
s
h
o
ws s
im
u
lated
p
r
o
p
o
s
ed
s
tr
u
ctu
r
e
.
T
h
er
m
al
m
a
n
ag
em
e
n
t
s
y
s
tem
d
iag
r
am
2
u
s
es
f
in
s
an
d
T
SV
s
to
d
is
s
ip
ate
h
ea
t.
Fin
s
tr
an
s
f
er
h
ea
t
to
th
e
T
SV
f
o
r
ef
f
ec
tiv
e
th
e
r
m
al
co
n
tr
o
l
.
Hea
t
is
d
ir
ec
ted
awa
y
f
r
o
m
th
e
p
o
wer
s
o
u
r
c
e
to
p
r
ev
e
n
t
lo
ca
l
o
v
er
h
ea
tin
g
.
Fig
u
r
e
3
illu
s
tr
ates
th
e
p
o
wer
s
o
u
r
ce
,
th
er
m
al,
an
d
g
r
o
u
n
d
T
SVs
'
o
r
g
an
ized
p
o
s
itio
n
in
g
.
T
h
e
lay
o
u
t
is
cr
itical
f
o
r
h
ea
t
d
is
s
ip
ati
o
n
an
d
elec
tr
ical
co
m
m
u
n
icatio
n
.
T
SV
p
lace
m
e
n
t
o
p
tim
izes
th
er
m
al
ch
an
n
els
f
o
r
o
p
tim
u
m
p
er
f
o
r
m
an
ce
.
C
NT
A
p
o
wer
s
u
p
p
ly
lin
k
ed
to
T
SVs
an
d
a
th
er
m
a
l
T
SV
w
ith
an
ex
tr
a
elem
en
t
to
i
n
cr
ea
s
e
h
ea
t
d
is
s
ip
atio
n
is
s
h
o
wn
in
Fig
u
r
e
4
.
T
h
is
s
tr
u
ctu
r
al
co
m
p
o
n
en
t
s
tab
il
izes
s
y
s
tem
tem
p
er
atu
r
e.
T
h
e
d
esig
n
b
alan
ce
s
h
ea
t
d
is
s
ip
atio
n
an
d
elec
tr
ical
f
u
n
ctio
n
in
g
.
Pro
p
er
h
ea
t
d
i
s
p
er
s
io
n
im
p
r
o
v
es
s
etu
p
r
eliab
ilit
y
an
d
ef
f
icien
c
y
.
T
SVs
an
d
o
th
er
th
er
m
al
s
tr
u
ctu
r
es
o
p
tim
ize
s
y
s
tem
p
er
f
o
r
m
an
ce
an
d
av
o
id
th
er
m
al
b
o
ttlen
ec
k
s
.
T
ab
le
2
p
r
o
v
id
es I
T
R
S
r
o
ad
m
a
p
T
SV
d
i
m
en
s
io
n
s
.
B
y
d
ir
ec
tin
g
th
e
f
in
'
s
h
ea
t
s
p
r
ea
d
er
la
y
er
i
n
th
e
o
p
p
o
s
ite
d
ir
ec
tio
n
o
f
t
h
e
T
T
SV,
p
er
f
o
r
m
an
ce
is
en
h
an
ce
d
.
T
h
e
T
T
SV
-
co
n
tain
i
n
g
an
d
-
f
r
ee
s
im
u
lated
r
ef
er
en
ce
s
tr
u
ctu
r
es
wer
e
co
m
p
ar
ed
.
T
h
e
en
h
an
ce
d
h
ea
t
tr
an
s
f
er
p
e
r
f
o
r
m
an
ce
p
r
o
v
id
ed
b
y
a
3
D
lay
er
s
tr
u
ctu
r
e
u
s
in
g
T
T
SV
is
clea
r
ly
s
ee
n
in
Fig
u
r
e
5
.
W
h
en
it
co
m
es
to
th
er
m
al
m
an
ag
em
en
t
o
f
a
3
DI
C
,
C
NT
s
ar
e
s
u
p
er
io
r
to
g
r
ap
h
en
e
(
Gr
ap
h
en
e)
wh
en
u
s
in
g
a
FIN
p
ath
with
a
cy
lin
d
er
.
Hea
t
wh
ich
is
tr
an
s
m
itted
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ated
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Fig
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u
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1
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in
v
a
r
io
u
s
d
ir
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tio
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s
T
ab
le
1
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Su
g
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ested
m
ater
ial
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Fin
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d
s
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al
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t
C
N
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Th
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m
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Fig
u
r
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2.
Simu
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p
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s
ed
s
tr
u
ctu
r
e
Fig
u
r
e
3.
Simu
lated
s
tr
u
ct
u
r
e
o
f
T
T
SV w
ith
o
u
t FI
N
T
ab
le
2
.
Dim
en
s
io
n
s
o
f
T
SV a
s
p
er
I
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R
S
r
o
ad
m
ap
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e
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7
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6
E
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1211
Fig
u
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4.
Simu
lated
s
tr
u
ct
u
r
e
o
f
T
T
SV w
ith
FIN
Fig
u
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5.
Simu
lated
a
r
ch
itectu
r
e
T
T
SV w
ith
o
u
t FI
N
Fig
u
r
e
6.
Simu
lated
a
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ch
itectu
r
e
T
T
SV w
ith
FIN
to
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d
s
h
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at
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3.
RE
SU
L
T
S AN
D
D
I
SCU
SS
I
O
NS
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o
m
p
ar
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e
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r
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al
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n
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o
f
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NT
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n
s
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u
cted
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d
T
SV,
an
d
s
h
o
w
th
at
th
e
f
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r
m
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etter
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f
C
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'
s
ab
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to
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ed
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ce
h
ea
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FIN
'
s
tem
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atu
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s
eld
o
m
ch
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g
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T
h
e
d
r
a
m
atic
tem
p
er
atu
r
e
ch
an
g
es
s
ee
n
in
T
SV
(
Fig
u
r
e
7
)
lead
it
to
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d
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ce
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er
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.
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iv
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ce
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ce
s
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t.
Fig
u
r
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8
s
h
o
ws
th
e
v
ar
iatio
n
s
in
FIN
an
d
T
SV
tem
p
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atu
r
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Sin
ce
g
r
ap
h
en
e,
t
h
e
FIN
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as
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o
r
th
er
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al
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n
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u
ctiv
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,
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tem
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atu
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v
ar
iatio
n
s
a
r
e
c
o
m
p
ar
ab
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to
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SV.
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ik
e
th
e
T
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th
e
Gr
a
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h
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s
o
r
b
s
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t
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m
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e
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ter
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al
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r
ce
.
Fig
u
r
e
9
s
h
o
ws
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h
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tem
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ch
a
n
g
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o
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NT
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ilt
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ctio
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at
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ial
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ak
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wer
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r
ce
to
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l
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aster
th
an
T
SV.
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h
e
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r
ce
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SV settles
n
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r
tem
p
er
atu
r
e,
an
d
th
e
FIN
to
p
o
wer
s
u
p
p
l
y
FIN
is
C
NT
.
Evaluation Warning : The document was created with Spire.PDF for Python.
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n
f
&
C
o
m
m
u
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T
ec
h
n
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l
,
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l.
1
5
,
No
.
3
,
Sep
tem
b
er
20
2
6
:
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2
0
8
-
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2
1
6
1212
Fig
u
r
e
7
.
FIN
with
C
NT
FIN
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war
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ce
Fig
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ce
Fig
u
r
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9
.
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NT
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ased
FIN
wit
h
a
T
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lean
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g
o
r
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tatio
n
Fig
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r
e
1
0
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e
m
o
n
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tr
ates
tem
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atu
r
e
ch
an
g
e
with
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ap
h
e
n
e
-
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ased
FIN
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d
T
SV
p
o
wer
s
o
u
r
ce
s
.
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h
e
ac
co
m
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a
n
y
in
g
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h
ar
t
s
h
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ws
th
at
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wer
s
o
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r
ce
tem
p
er
at
u
r
e
v
ar
ies
s
im
ilar
ly
f
o
r
T
SV
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d
FIN
.
T
h
e
lim
ited
h
ea
t
co
n
d
u
ctiv
ity
o
f
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a
p
h
en
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s
es
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Fig
u
r
e
1
1
illu
s
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ates
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e
th
er
m
al
b
eh
av
io
r
o
f
th
r
o
u
g
h
-
s
ilico
n
v
ias
(
T
SVs
)
u
n
d
er
s
p
ec
if
ic
c
o
n
d
i
tio
n
s
.
I
t
h
ig
h
lig
h
ts
tem
p
er
atu
r
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v
ar
iatio
n
s
ac
r
o
s
s
d
if
f
er
en
t
r
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io
n
s
,
s
h
o
win
g
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er
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al
g
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ad
ie
n
ts
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d
p
o
ten
tia
l
h
o
ts
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o
ts
.
T
h
e
r
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lts
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elp
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n
d
er
s
tan
d
i
n
g
h
ea
t
d
is
s
ip
atio
n
ef
f
icien
cy
in
T
SV
s
tr
u
ctu
r
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Fig
u
r
e
1
2
p
r
ese
n
ts
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m
p
ar
ativ
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aly
s
is
o
f
th
er
m
al
p
er
f
o
r
m
an
ce
in
d
if
f
er
en
t
T
SV
co
n
f
ig
u
r
atio
n
s
.
I
t d
em
o
n
s
tr
ate
s
h
o
w
d
esig
n
m
o
d
if
icatio
n
s
im
p
ac
t te
m
p
er
atu
r
e
d
is
tr
ib
u
tio
n
an
d
o
v
er
all
th
er
m
al
m
an
ag
em
en
t.
T
h
e
in
s
ig
h
ts
ass
is
t in
o
p
tim
izin
g
T
SV stru
ctu
r
e
s
f
o
r
im
p
r
o
v
ed
t
h
er
m
al
r
eliab
il
ity
.
Evaluation Warning : The document was created with Spire.PDF for Python.
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f
&
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o
m
m
u
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T
ec
h
n
o
l
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7
7
6
E
n
h
a
n
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d
th
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l m
a
n
a
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t in
3
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in
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r
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ted
circu
its
co
u
p
lin
g
(
V
emp
a
lle
R
a
fi
)
1213
Fig
u
r
e
1
0
.
Gr
ap
h
e
n
e
-
b
ased
FI
N
f
ac
in
g
T
SV
Fig
u
r
e
11.
C
o
m
p
ar
is
o
n
o
f
Al2
o
3
,
Sio
2
,
Si3
n
4
Fig
u
r
e
12
.
C
o
m
p
ar
is
o
n
o
f
Sio
2
,
Si3
n
4
4.
CO
NCLU
SI
O
N
T
h
e
in
ter
ac
tio
n
b
etwe
en
C
NT
an
d
g
r
a
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h
en
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an
d
FIN
is
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ig
n
if
ican
tly
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f
lu
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n
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d
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y
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e
te
m
p
er
atu
r
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m
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ar
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to
th
e
th
er
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al
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g
im
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ac
t
o
f
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air
ed
with
g
r
ap
h
en
e,
th
e
ef
f
ec
t
o
f
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m
ix
ed
with
C
NT
s
o
f
f
er
s
h
ig
h
er
p
er
f
o
r
m
a
n
ce
.
FIN
m
ad
e
o
f
C
NT
an
d
d
ir
ec
ted
to
war
d
s
h
ea
t
s
o
u
r
ce
en
h
a
n
ce
s
th
e
I
C
'
s
Evaluation Warning : The document was created with Spire.PDF for Python.
I
SS
N
:
2252
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8
7
7
6
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f
&
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m
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T
ec
h
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l
,
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l.
1
5
,
No
.
3
,
Sep
tem
b
er
20
2
6
:
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2
0
8
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1
2
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6
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tem
p
er
atu
r
e
r
esis
tan
ce
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d
p
r
o
v
id
es
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etter
r
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lts
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an
FIN
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f
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NT
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o
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tated
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SV,
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e
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am
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atio
n
o
f
th
e
th
r
ee
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is
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ct
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ater
ials
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3
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s
i3
n
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s
io
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,
FIN
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o
n
s
tr
u
cted
o
f
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NT
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ter
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an
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m
ad
e
o
f
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NT
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o
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r
d
s
T
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h
e
a
b
ilit
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o
f
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n
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t tr
a
n
s
f
er
is
m
u
ch
h
i
g
h
er
th
a
n
th
at
o
f
eith
e
r
Al2
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o
r
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2
.
ACK
NO
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h
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th
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